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FACILITIES

SMT LINE

parallax background

FACILITIES

SMT LINE

OUR FACILITIES

In order to solve any problem, prompt reaction and better quality, we have SMT (Surface Mounting Technology) equipment.

OUR FACILITIES

In order to solve any problem, prompt reaction and better quality, we have SMT (Surface Mounting Technology) equipment.


LIST



Name Model/ManufacturerQuantityDescription
Screen Printer HP-520S / SJ INNO TECH 1 3D Solder Pates Inspection : SPI
High-speed Chip Mounter SM320 / SAMSUNG TECHWINI 1 Mounting speed : 18,000/CPH (Mounting condition improvement by using optical lens and available to mount micro chip
High-speed Multi Mounter SM320 / SAMSUNG TECHWINI 1 Mounting speed : 18,000/CPH, component automatic recognition function
High-speed Multi Mounter Tray Changer SM421 / SAMSUNG TECHWINI L1-0265-A4 / SAMSUNG TECHWINI 1 Mounting speed : 21,000/CPH, component automatic recognition function & 24kinds of tray part input availability
Reflow oven 1809EXL / HELLER 1 9 Heating zone, 2 Cooling zone, Flux dust collection, Nitrogen reflow soldering
A.O.I MASS 1 Color camera for color change of component recognition, high resolution camera (0603 Chip/0.4mm pitch, soldering inspection), Component library support (Touch and debugging time reduction)

LIST



Name Model
/Manufacturer
QuantityDescription
Screen Printer HP-520S / SJ INNO TECH 1 3D Solder Pates Inspection : SPI
High-speed Chip Mounter SM320 / SAMSUNG TECHWINI 1 Mounting speed : 18,000/CPH (Mounting condition improvement by using optical lens and available to mount micro chip
High-speed Multi Mounter SM320 / SAMSUNG TECHWINI 1 Mounting speed : 18,000/CPH, component automatic recognition function
High-speed Multi Mounter Tray Changer SM421 / SAMSUNG TECHWINI L1-0265-A4 / SAMSUNG TECHWINI 1 Mounting speed : 21,000/CPH, component automatic recognition function & 24kinds of tray part input availability
Reflow oven 1809EXL / HELLER 1 9 Heating zone, 2 Cooling zone, Flux dust collection, Nitrogen reflow soldering
A.O.I MASS 1 Color camera for color change of component recognition, high resolution camera (0603 Chip/0.4mm pitch, soldering inspection), Component library support (Touch and debugging time reduction)
 

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